Valeo, a global leader in automotive technology, and Calyos, a pioneer in advanced Loop Heat Pipe cooling systems, announce the signing of a Memorandum of Understanding. The agreement aims to develop and industrialize high-performance, standalone chip cooling solutions for the mobility and IT industries, meeting the critical thermal requirements of electrification and artificial intelligence.
By combining Calyos’ expertise in two-phase fluid loop technology with Valeo’s cutting-edge thermal engineering and global industrial capacity, the two partners are launching a new generation of two-phase passive systems. These solutions are more efficient because they can handle high heat flows, while being more compact, easy to integrate, maintenance-free, and highly reliable.
Meeting the challenges of tomorrow’s mobility
As automotive electrification intensifies, driven by the development of Centralized Architecture Vehicles (SDVs), the computing power and heat generated by power electronics are increasing exponentially.
Valeo-Calyos’ passive two-phase cooling solution provides concrete benefits for:
Power electronics: autonomous cooling for on-board charger (OBC) electronics, inverters and integrated “x-in-1” electronic systems. This solution offers a compact and independent plug-and-play cooling system. For components located at the rear of the vehicle, it allows energy savings and a major simplification of the architecture of the vehicle’s overall thermal system;
Software-Defined Vehicle (SDV): Architectures for software-defined vehicles are leading to the centralization of ECUs, and to the increase in chip power densities. Our solution provides optimal, self-contained, compact, and reliable heat dissipation for high-speed processors. It ensures consistent performance and simplified integration, eliminating the complexity of traditional distributed liquid cooling loops.
Revolutionizing data center efficiency and AI scalability
Valeo leverages its decades of expertise in automotive thermal management to serve the data center industry, offering a complete and scalable cooling ecosystem.
The collaboration also targets the growing data centre market, beyond the mobility sector. The acceleration of AI is driving an increase in data centre power and CPU cooling demand. This creates an urgent need for better thermal efficiency in order to reduce global energy consumption (Energy Efficiency Indicator (PUE) optimisation).
One of our first joint achievements, a promising, intelligent and promising two-phase passive cooling solution for data centers, offers:
Optimal energy efficiency thanks to the two-phase fluid loop effect, meeting the increased requirements of processor power and high heat flows, and this without an active element (no fluid pump),
Ease of improving the performance of existing servers, by air thanks to a self-contained cooling unit with a two-phase fluid loop for each individual server within an array. This solution enables data centers to increase their power density through direct-to-chip cooling, without having to restructure their entire infrastructure.
Reliability and compactness ensured by a high-efficiency passive two-phase cooling system that simplifies maintenance (no active fluid pump) and reduces the risk of leaks compared to traditional water cooling methods (lower dielectric fluid pressure).